Effect of SiO 2 nanoparticles on the thermal properties of dielectric composite films

Lei Yao, Lu Chen, Yuqiang Chen and Xiaoxiao Sun

International Journal of Manufacturing Technology and Management, 2016, vol. 30, issue 6, 410-421

Abstract: In order to investigate the influence of SiO₂ nanoparticles on the thermal properties of polyimide (PI) composite films, the experimental data of nanocomposite films with changing heat is determined by thermal-gravimetric analysis (TGA) and differential thermal analysis (DTA). The results show that the thermal stability of composite films increases from 500°C to 100°C; the requirement of decomposition heat increases from 30 nw to 60 nw, which is twice as large as the requirement of pure PI; the initial decomposition temperature of composite films is remarkable higher than pure PI and when the weight loss is 5 wt% the temperature increases from 200°C to 520°C, which is 2.5 times. This suggests that adding inorganic nanoparticles can effectively improve the thermal properties of composite film. With increasing content, nanoparticles can form thermal network in the matrix, which is one of important reasons to improve the thermal properties of composite films.

Keywords: SiO2 nanoparticles; silicon dioxide; silica; thermal weight loss; dielectric composite films; polyimide composite films; nanocomposites; nanotechnology; decomposition temperature; inorganic nanoparticles; thermal properties. (search for similar items in EconPapers)
Date: 2016
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