Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation

So-Yeon Lee, Kyung Ryoul Park, Sung-gyu Kang, Ji-Hoon Lee, Eun-chae Jeon, Cheol-Hwee Shim, Jae-Pyoung Ahn, Dong-Ik Kim, Heung Nam Han, Young-Chang Joo (), Changsoon Kim () and In-Suk Choi ()
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So-Yeon Lee: Seoul National University
Kyung Ryoul Park: Seoul National University
Sung-gyu Kang: Seoul National University
Ji-Hoon Lee: Korea Institute of Materials Science (KIMS)
Eun-chae Jeon: University of Ulsan
Cheol-Hwee Shim: Korea Institute of Science and Technology
Jae-Pyoung Ahn: Korea Institute of Science and Technology
Dong-Ik Kim: Korea Institute of Science and Technology
Heung Nam Han: Seoul National University
Young-Chang Joo: Seoul National University
Changsoon Kim: Seoul National University
In-Suk Choi: Seoul National University

Nature Communications, 2019, vol. 10, issue 1, 1-8

Abstract: Abstract While cracks are usually considered detrimental, crack generation can be harnessed for various applications, for example in ceramic materials, via directing crack propagation and crack opening. Here, we find that electron beam irradiation prompts a crack suppression phenomenon in a copper (Cu) thin film on a polyimide substrate, allowing for the control of crack formation in terms of both location and shape. Under tensile strain, cracks form on the unirradiated region of the Cu film whereas cracks are prevented on the irradiated region. We attribute this to the enhancement of the adhesion at the Cu–polyimide interface by electrons transmitted through the Cu film. Finally, we selectively form conductive regions in a Cu film on a polyimide substrate under tension and fabricate a strain-responsive organic light-emitting device.

Date: 2019
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DOI: 10.1038/s41467-019-12451-8

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