Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix

Shantonu Biswas, Andreas Schoeberl, Yufei Hao, Johannes Reiprich, Thomas Stauden, Joerg Pezoldt and Heiko O. Jacobs ()
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Shantonu Biswas: Elings Hall, Building 266, Mesa Road, University of California
Andreas Schoeberl: Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1
Yufei Hao: Haidian District, Beijing Institute of Road 37, Beihang University
Johannes Reiprich: Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1
Thomas Stauden: Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1
Joerg Pezoldt: Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1
Heiko O. Jacobs: Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1

Nature Communications, 2019, vol. 10, issue 1, 1-8

Abstract: Abstract Conventional rigid electronic systems use a number of metallization layers to route all necessary connections to and from isolated surface mount devices using well-established printed circuit board technology. In contrast, present solutions to prepare stretchable electronic systems are typically confined to a single stretchable metallization layer. Crossovers and vertical interconnect accesses remain challenging; consequently, no reliable stretchable printed circuit board (SPCB) method has established. This article reports an industry compatible SPCB manufacturing method that enables multilayer crossovers and vertical interconnect accesses to interconnect isolated devices within an elastomeric matrix. As a demonstration, a stretchable (260%) active matrix with integrated electronic and optoelectronic surface mount devices is shown that can deform reversibly into various 3D shapes including hemispherical, conical or pyramid.

Date: 2019
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DOI: 10.1038/s41467-019-12870-7

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