Electronic heat flow and thermal shot noise in quantum circuits

E. Sivre, H. Duprez, A. Anthore, A. Aassime, F. D. Parmentier, A. Cavanna, A. Ouerghi, U. Gennser and F. Pierre ()
Additional contact information
E. Sivre: Centre de Nanosciences et de Nanotechnologies (C2N)
H. Duprez: Centre de Nanosciences et de Nanotechnologies (C2N)
A. Anthore: Centre de Nanosciences et de Nanotechnologies (C2N)
A. Aassime: Centre de Nanosciences et de Nanotechnologies (C2N)
F. D. Parmentier: Centre de Nanosciences et de Nanotechnologies (C2N)
A. Cavanna: Centre de Nanosciences et de Nanotechnologies (C2N)
A. Ouerghi: Centre de Nanosciences et de Nanotechnologies (C2N)
U. Gennser: Centre de Nanosciences et de Nanotechnologies (C2N)
F. Pierre: Centre de Nanosciences et de Nanotechnologies (C2N)

Nature Communications, 2019, vol. 10, issue 1, 1-8

Abstract: Abstract When assembling individual quantum components into a mesoscopic circuit, the interplay between Coulomb interaction and charge granularity breaks down the classical laws of electrical impedance composition. Here we explore experimentally the thermal consequences, and observe an additional quantum mechanism of electronic heat transport. The investigated, broadly tunable test-bed circuit is composed of a micron-scale metallic node connected to one electronic channel and a resistance. Heating up the node with Joule dissipation, we separately determine, from complementary noise measurements, both its temperature and the thermal shot noise induced by the temperature difference across the channel. The thermal shot noise predictions are thereby directly validated, and the electronic heat flow is revealed. The latter exhibits a contribution from the channel involving the electrons’ partitioning together with the Coulomb interaction. Expanding heat current predictions to include the thermal shot noise, we find a quantitative agreement with experiments.

Date: 2019
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DOI: 10.1038/s41467-019-13566-8

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