Efficient strain modulation of 2D materials via polymer encapsulation

Zhiwei Li, Yawei Lv, Liwang Ren, Jia Li, Lingan Kong, Yujia Zeng, Quanyang Tao, Ruixia Wu, Huifang Ma, Bei Zhao, Di Wang, Weiqi Dang, Keqiu Chen, Lei Liao, Xidong Duan, Xiangfeng Duan and Yuan Liu ()
Additional contact information
Zhiwei Li: Hunan University
Yawei Lv: Hunan University
Liwang Ren: Hunan University
Jia Li: Hunan University
Lingan Kong: Hunan University
Yujia Zeng: Hunan University
Quanyang Tao: Hunan University
Ruixia Wu: Hunan University
Huifang Ma: Hunan University
Bei Zhao: Hunan University
Di Wang: Hunan University
Weiqi Dang: Hunan University
Keqiu Chen: Hunan University
Lei Liao: Hunan University
Xidong Duan: Hunan University
Xiangfeng Duan: University of California
Yuan Liu: Hunan University

Nature Communications, 2020, vol. 11, issue 1, 1-8

Abstract: Abstract Strain engineering is a promising method to manipulate the electronic and optical properties of two-dimensional (2D) materials. However, with weak van der Waals interaction, severe slippage between 2D material and substrate could dominate the bending or stretching processes, leading to inefficiency strain transfer. To overcome this limitation, we report a simple strain engineering method by encapsulating the monolayer 2D material in the flexible PVA substrate through spin-coating approach. The strong interaction force between spin-coated PVA and 2D material ensures the mechanical strain can be effectively transferred with negligible slippage or decoupling. By applying uniaxial strain to monolayer MoS2, we observe a higher bandgap modulation up to ~300 meV and a highest modulation rate of ~136 meV/%, which is approximate two times improvement compared to previous results achieved. Moreover, this simple strategy could be well extended to other 2D materials such as WS2 or WSe2, leading to enhanced bandgap modulation.

Date: 2020
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DOI: 10.1038/s41467-020-15023-3

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