Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

Jiangfeng Ni, Xiaocui Zhu, Yifei Yuan, Zhenzhu Wang, Yingbo Li, Lu Ma, Alvin Dai, Matthew Li, Tianpin Wu, Reza Shahbazian-Yassar, Jun Lu and Liang Li ()
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Jiangfeng Ni: Soochow University
Xiaocui Zhu: Soochow University
Yifei Yuan: Argonne National Laboratory
Zhenzhu Wang: Soochow University
Yingbo Li: Tianjin University
Lu Ma: Argonne National Laboratory
Alvin Dai: Argonne National Laboratory
Matthew Li: Argonne National Laboratory
Tianpin Wu: Argonne National Laboratory
Reza Shahbazian-Yassar: University of Illinois at Chicago
Jun Lu: Argonne National Laboratory
Liang Li: Soochow University

Nature Communications, 2020, vol. 11, issue 1, 1-8

Abstract: Abstract The need for high-energy batteries has driven the development of binder-free electrode architectures. However, the weak bonding between the electrode particles and the current collector cannot withstand the severe volume change of active materials upon battery cycling, which largely limit the large-scale application of such electrodes. Using tin nanoarrays electrochemically deposited on copper substrate as an example, here we demonstrate a strategy of strengthening the connection between electrode and current collector by thermally alloying tin and copper at their interface. The locally formed tin-copper alloys are electron-conductive and meanwhile electrochemically inactive, working as an ideal “glue” robustly bridging tin and copper to survive harsh cycling conditions in sodium ion batteries. The working mechanism of the alloy “glue” is further characterized through a combination of electrochemical impedance spectroscopy, atomic structural analysis and in situ X-ray diffraction, presenting itself as a promising strategy for engineering binder-free electrode with endurable performance.

Date: 2020
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DOI: 10.1038/s41467-020-15045-x

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