Heterogeneously integrated flexible microwave amplifiers on a cellulose nanofibril substrate

Huilong Zhang, Jinghao Li, Dong Liu, Seunghwan Min, Tzu-Hsuan Chang, Kanglin Xiong, Sung Hyun Park, Jisoo Kim, Yei Hwan Jung, Jeongpil Park, Juhwan Lee, Jung Han, Linda Katehi, Zhiyong Cai (), Shaoqin Gong () and Zhenqiang Ma ()
Additional contact information
Huilong Zhang: University of Wisconsin–Madison
Jinghao Li: USDA Forest Service
Dong Liu: University of Wisconsin–Madison
Seunghwan Min: University of Wisconsin–Madison
Tzu-Hsuan Chang: University of Wisconsin–Madison
Kanglin Xiong: University of Wisconsin–Madison
Sung Hyun Park: Yale University
Jisoo Kim: University of Wisconsin–Madison
Yei Hwan Jung: University of Wisconsin–Madison
Jeongpil Park: University of Wisconsin–Madison
Juhwan Lee: University of Wisconsin–Madison
Jung Han: Yale University
Linda Katehi: Texas A&M University
Zhiyong Cai: USDA Forest Service
Shaoqin Gong: University of Wisconsin–Madison
Zhenqiang Ma: University of Wisconsin–Madison

Nature Communications, 2020, vol. 11, issue 1, 1-11

Abstract: Abstract Low-cost flexible microwave circuits with compact size and light weight are highly desirable for flexible wireless communication and other miniaturized microwave systems. However, the prevalent studies on flexible microwave electronics have only focused on individual flexible microwave elements such as transistors, inductors, capacitors, and transmission lines. Thinning down supporting substrate of rigid chip-based monolithic microwave integrated circuits has been the only approach toward flexible microwave integrated circuits. Here, we report a flexible microwave integrated circuit strategy integrating membrane AlGaN/GaN high electron mobility transistor with passive impedance matching networks on cellulose nanofibril paper. The strategy enables a heterogeneously integrated and, to our knowledge, the first flexible microwave amplifier that can output 10 mW power beyond 5 GHz and can also be easily disposed of due to the use of cellulose nanofibril paper as the circuit substrate. The demonstration represents a critical step forward in realizing flexible wireless communication devices.

Date: 2020
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DOI: 10.1038/s41467-020-16957-4

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