3D electron-beam writing at sub-15 nm resolution using spider silk as a resist
Nan Qin,
Zhi-Gang Qian,
Chengzhe Zhou,
Xiao-Xia Xia () and
Tiger H. Tao ()
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Nan Qin: Chinese Academy of Sciences
Zhi-Gang Qian: Shanghai Jiao Tong University
Chengzhe Zhou: Chinese Academy of Sciences
Xiao-Xia Xia: Shanghai Jiao Tong University
Tiger H. Tao: Chinese Academy of Sciences
Nature Communications, 2021, vol. 12, issue 1, 1-10
Abstract:
Abstract Electron beam lithography (EBL) is renowned to provide fabrication resolution in the deep nanometer scale. One major limitation of current EBL techniques is their incapability of arbitrary 3d nanofabrication. Resolution, structure integrity and functionalization are among the most important factors. Here we report all-aqueous-based, high-fidelity manufacturing of functional, arbitrary 3d nanostructures at a resolution of sub-15 nm using our developed voltage-regulated 3d EBL. Creating arbitrary 3d structures of high resolution and high strength at nanoscale is enabled by genetically engineering recombinant spider silk proteins as the resist. The ability to quantitatively define structural transitions with energetic electrons at different depths within the 3d protein matrix enables polymorphic spider silk proteins to be shaped approaching the molecular level. Furthermore, genetic or mesoscopic modification of spider silk proteins provides the opportunity to embed and stabilize physiochemical and/or biological functions within as-fabricated 3d nanostructures. Our approach empowers the rapid and flexible fabrication of heterogeneously functionalized and hierarchically structured 3d nanocomponents and nanodevices, offering opportunities in biomimetics, therapeutic devices and nanoscale robotics.
Date: 2021
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Persistent link: https://EconPapers.repec.org/RePEc:nat:natcom:v:12:y:2021:i:1:d:10.1038_s41467-021-25470-1
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DOI: 10.1038/s41467-021-25470-1
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