Wafer-scale integration of stretchable semiconducting polymer microstructures via capillary gradient

Yuchen Qiu, Bo Zhang, Junchuan Yang (), Hanfei Gao, Shuang Li, Le Wang, Penghua Wu, Yewang Su, Yan Zhao (), Jiangang Feng (), Lei Jiang and Yuchen Wu
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Yuchen Qiu: Chinese Academy of Sciences
Bo Zhang: Beijing Institute of Technology
Junchuan Yang: Chinese Academy of Sciences
Hanfei Gao: Chinese Academy of Sciences
Shuang Li: Chinese Academy of Sciences
Le Wang: Southern University of Science and Technology
Penghua Wu: Chinese Academy of Sciences
Yewang Su: Chinese Academy of Sciences
Yan Zhao: Fudan University
Jiangang Feng: National University of Singapore
Lei Jiang: Chinese Academy of Sciences
Yuchen Wu: Chinese Academy of Sciences

Nature Communications, 2021, vol. 12, issue 1, 1-9

Abstract: Abstract Organic semiconducting polymers have opened a new paradigm for soft electronics due to their intrinsic flexibility and solution processibility. However, the contradiction between the mechanical stretchability and electronic performances restricts the implementation of high-mobility polymers with rigid molecular backbone in deformable devices. Here, we report the realization of high mobility and stretchability on curvilinear polymer microstructures fabricated by capillary-gradient assembly method. Curvilinear polymer microstructure arrays are fabricated with highly ordered molecular packing, controllable pattern, and wafer-scale homogeneity, leading to hole mobilities of 4.3 and 2.6 cm2 V−1 s−1 under zero and 100% strain, respectively. Fully stretchable field-effect transistors and logic circuits can be integrated in solution process. Long-range homogeneity is demonstrated with the narrow distribution of height, width, mobility, on-off ratio and threshold voltage across a four-inch wafer. This solution-assembly method provides a platform for wafer-scale and reproducible integration of high-performance soft electronic devices and circuits based on organic semiconductors.

Date: 2021
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DOI: 10.1038/s41467-021-27370-w

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