Self-assembly and photoinduced fabrication of conductive nanographene wires on boron nitride

Xiaoxi Zhang, Fabian Gärisch, Zongping Chen, Yunbin Hu, Zishu Wang, Yan Wang, Liming Xie, Jianing Chen, Juan Li, Johannes V. Barth, Akimitsu Narita, Emil List-Kratochvil, Klaus Müllen and Carlos-Andres Palma ()
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Xiaoxi Zhang: Chinese Academy of Sciences
Fabian Gärisch: Department of Chemistry & IRIS Adlershof - Humboldt-Universität zu Berlin
Zongping Chen: Max Planck Institute for Polymer Research
Yunbin Hu: Max Planck Institute for Polymer Research
Zishu Wang: Chinese Academy of Sciences
Yan Wang: Chinese Academy of Sciences
Liming Xie: National Center for Nanoscience and Technology
Jianing Chen: Chinese Academy of Sciences
Juan Li: Beijing Institute of Technology
Johannes V. Barth: Technische Universität München
Akimitsu Narita: Max Planck Institute for Polymer Research
Emil List-Kratochvil: Department of Chemistry & IRIS Adlershof - Humboldt-Universität zu Berlin
Klaus Müllen: Max Planck Institute for Polymer Research
Carlos-Andres Palma: Chinese Academy of Sciences

Nature Communications, 2022, vol. 13, issue 1, 1-8

Abstract: Abstract Manufacturing molecule-based functional elements directly at device interfaces is a frontier in bottom-up materials engineering. A longstanding challenge in the field is the covalent stabilization of pre-assembled molecular architectures to afford nanodevice components. Here, we employ the controlled supramolecular self-assembly of anthracene derivatives on a hexagonal boron nitride sheet, to generate nanographene wires through photo-crosslinking and thermal annealing. Specifically, we demonstrate µm-long nanowires with an average width of 200 nm, electrical conductivities of 106 S m−1 and breakdown current densities of 1011 A m−2. Joint experiments and simulations reveal that hierarchical self-assembly promotes their formation and functional properties. Our approach demonstrates the feasibility of combined bottom-up supramolecular templating and top-down manufacturing protocols for graphene nanomaterials and interconnects, towards integrated carbon nanodevices.

Date: 2022
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DOI: 10.1038/s41467-021-27600-1

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