λ/30 inorganic features achieved by multi-photon 3D lithography

Feng Jin (), Jie Liu, Yuan-Yuan Zhao, Xian-Zi Dong, Mei-Ling Zheng () and Xuan-Ming Duan ()
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Feng Jin: Laboratory of Organic NanoPhotonics and CAS Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Jie Liu: Laboratory of Organic NanoPhotonics and CAS Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Yuan-Yuan Zhao: Jinan University
Xian-Zi Dong: Laboratory of Organic NanoPhotonics and CAS Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Mei-Ling Zheng: Laboratory of Organic NanoPhotonics and CAS Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences
Xuan-Ming Duan: Jinan University

Nature Communications, 2022, vol. 13, issue 1, 1-10

Abstract: Abstract It’s critically important to construct arbitrary inorganic features with high resolution. As an inorganic photoresist, hydrogen silsesquioxane (HSQ) has been patterned by irradiation sources with short wavelength, such as EUV and electron beam. However, the fabrication of three- dimensional nanoscale HSQ features utilizing infrared light sources is still challenging. Here, we demonstrate femtosecond laser direct writing (FsLDW) of HSQ through multi-photon absorption process. 26 nm feature size is achieved by using 780 nm fs laser, indicating super-diffraction limit photolithography of λ/30 for HSQ. HSQ microstructures by FsLDW possess nanoscale resolution, smooth surface, and thermal stability up to 600 °C. Furthermore, we perform FsLDW of HSQ to construct structural colour and Fresnel lens with desirable optical properties, thermal and chemical resistance. This study demonstrates that inorganic features can be flexibly achieved by FsLDW of HSQ, which would be prospective for fabricating micro-nano devices requiring nanoscale resolution, thermal and chemical resistance.

Date: 2022
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DOI: 10.1038/s41467-022-29036-7

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