A new dimension for magnetosensitive e-skins: active matrix integrated micro-origami sensor arrays

Christian Becker, Bin Bao (), Dmitriy D. Karnaushenko, Vineeth Kumar Bandari, Boris Rivkin, Zhe Li, Maryam Faghih, Daniil Karnaushenko () and Oliver G. Schmidt ()
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Christian Becker: Chemnitz University of Technology
Bin Bao: Leibniz IFW Dresden
Dmitriy D. Karnaushenko: Chemnitz University of Technology
Vineeth Kumar Bandari: Chemnitz University of Technology
Boris Rivkin: Leibniz IFW Dresden
Zhe Li: Chemnitz University of Technology
Maryam Faghih: Leibniz IFW Dresden
Daniil Karnaushenko: Chemnitz University of Technology
Oliver G. Schmidt: Chemnitz University of Technology

Nature Communications, 2022, vol. 13, issue 1, 1-11

Abstract: Abstract Magnetic sensors are widely used in our daily life for assessing the position and orientation of objects. Recently, the magnetic sensing modality has been introduced to electronic skins (e-skins), enabling remote perception of moving objects. However, the integration density of magnetic sensors is limited and the vector properties of the magnetic field cannot be fully explored since the sensors can only perceive field components in one or two dimensions. Here, we report an approach to fabricate high-density integrated active matrix magnetic sensor with three-dimensional (3D) magnetic vector field sensing capability. The 3D magnetic sensor is composed of an array of self-assembled micro-origami cubic architectures with biased anisotropic magnetoresistance (AMR) sensors manufactured in a wafer-scale process. Integrating the 3D magnetic sensors into an e-skin with embedded magnetic hairs enables real-time multidirectional tactile perception. We demonstrate a versatile approach for the fabrication of active matrix integrated 3D sensor arrays using micro-origami and pave the way for new electronic devices relying on the autonomous rearrangement of functional elements in space.

Date: 2022
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DOI: 10.1038/s41467-022-29802-7

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