Integration of multiple electronic components on a microfibre towards an emerging electronic textile platform

Sunbin Hwang, Minji Kang, Aram Lee, Sukang Bae, Seoung-Ki Lee, Sang Hyun Lee, Takhee Lee, Gunuk Wang and Tae-Wook Kim ()
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Sunbin Hwang: Korea Institute of Science and Technology
Minji Kang: Jeonbuk National University
Aram Lee: Korea Institute of Science and Technology
Sukang Bae: Korea Institute of Science and Technology
Seoung-Ki Lee: Pusan National University
Sang Hyun Lee: Chonnam National University
Takhee Lee: Seoul National University
Gunuk Wang: Korea University
Tae-Wook Kim: Jeonbuk National University

Nature Communications, 2022, vol. 13, issue 1, 1-10

Abstract: Abstract Electronic fibres have been considered one of the desired device platforms due to their dimensional compatibility with fabrics by weaving with yarns. However, a precise connecting process between each electronic fibre is essential to configure the desired electronic circuits or systems. Here, we present an integrated electronic fibre platform by fabricating electronic devices onto a one-dimensional microfibre substrate. Electronic components such as transistors, inverters, ring oscillators, and thermocouples are integrated together onto the outer surface of a fibre substrate with precise semiconductor and electrode patterns. Our results show that electronic components can be integrated on a single fibre with reliable operation. We evaluate the electronic properties of the chip on the fibre as a multifunctional electronic textile platform by testing their switching and data processing, as well as sensing or transducing units for detecting optical/thermal signals. The demonstration of the electronic fibre suggests significant proof of concepts for the realization of high performance with wearable electronic textile systems.

Date: 2022
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DOI: 10.1038/s41467-022-30894-4

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