Tailoring thermal insulation architectures from additive manufacturing

Lu An, Zipeng Guo, Zheng Li, Yu Fu, Yong Hu, Yulong Huang, Fei Yao (), Chi Zhou () and Shenqiang Ren ()
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Lu An: University at Buffalo, The State University of New York
Zipeng Guo: University at Buffalo, The State University of New York
Zheng Li: University at Buffalo, The State University of New York
Yu Fu: University at Buffalo, The State University of New York
Yong Hu: University at Buffalo, The State University of New York
Yulong Huang: University at Buffalo, The State University of New York
Fei Yao: University at Buffalo, The State University of New York
Chi Zhou: University at Buffalo, The State University of New York
Shenqiang Ren: University at Buffalo, The State University of New York

Nature Communications, 2022, vol. 13, issue 1, 1-7

Abstract: Abstract Tailoring thermal transport by structural parameters could result in mechanically fragile and brittle networks. An indispensable goal is to design hierarchical architecture materials that combine thermal and mechanical properties in a continuous and cohesive network. A promising strategy to create such a hierarchical network targets additive manufacturing of hybrid porous voxels at nanoscale. Here we describe the convergence of agile additive manufacturing of porous hybrid voxels to tailor hierarchically and mechanically tunable objects. In one strategy, the uniformly distributed porous silica voxels, which form the basis for the control of thermal transport, are non-covalently interfaced with polymeric networks, yielding hierarchic super-elastic architectures with thermal insulation properties. Another additive strategy for achieving mechanical strength involves the versatile orthogonal surface hybridization of porous silica voxels retains its low thermal conductivity of 19.1 mW m−1 K−1, flexible compressive recovery strain (85%), and tailored mechanical strength from 71.6 kPa to 1.5 MPa. The printed lightweight high-fidelity objects promise thermal aging mitigation for lithium-ion batteries, providing a thermal management pathway using 3D printed silica objects.

Date: 2022
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DOI: 10.1038/s41467-022-32027-3

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