Migration of solidification grain boundaries and prediction

Hongmei Liu (), Shenglu Lu, Yingbo Zhang, Hui Chen, Yungui Chen and Ma Qian ()
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Hongmei Liu: Southwest Jiaotong University
Shenglu Lu: RMIT University
Yingbo Zhang: Southwest Jiaotong University
Hui Chen: Southwest Jiaotong University
Yungui Chen: Sichuan University
Ma Qian: RMIT University

Nature Communications, 2022, vol. 13, issue 1, 1-12

Abstract: Abstract Solidification processing is essential to the manufacture of various metal products, including additive manufacturing. Solidification grain boundaries (SGBs) result from the solidification of the last liquid film between two abutting grains of different orientations. They can migrate, but unlike normal GB migration, SGB migration (SGBM) decouples SGBs from solidification microsegregation, further affecting material properties. Here, we first show the salient features of SGBM in magnesium-tin alloys solidified with cooling rates of 8−1690 °C/s. A theoretical model is then developed for SGBM in dilute binary alloys, focusing on the effect of solute type and content, and applied to 10 alloy systems with remarkable agreement. SGMB does not depend on cooling rate or time but relates to grain size. It tends to occur athermally. The findings of this study extend perspectives on solidification grain structure formation and control for improved performance (e.g. hot or liquation cracking during reheating, intergranular corrosion or fracture).

Date: 2022
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DOI: 10.1038/s41467-022-33482-8

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