Silicone engineered anisotropic lithography for ultrahigh-density OLEDs

Hyukmin Kweon, Keun-Yeong Choi, Han Wool Park, Ryungyu Lee, Ukjin Jeong, Min Jung Kim, Hyunmin Hong, Borina Ha, Sein Lee, Jang-Yeon Kwon, Kwun-Bum Chung, Moon Sung Kang, Hojin Lee () and Do Hwan Kim ()
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Hyukmin Kweon: Hanyang University
Keun-Yeong Choi: Soongsil University
Han Wool Park: Hanyang University
Ryungyu Lee: Soongsil University
Ukjin Jeong: Hanyang University
Min Jung Kim: Dongguk University
Hyunmin Hong: Dongguk University
Borina Ha: Hanyang University
Sein Lee: Yonsei University
Jang-Yeon Kwon: Yonsei University
Kwun-Bum Chung: Dongguk University
Moon Sung Kang: Sogang University
Hojin Lee: Soongsil University
Do Hwan Kim: Hanyang University

Nature Communications, 2022, vol. 13, issue 1, 1-10

Abstract: Abstract Ultrahigh-resolution patterning with high-throughput and high-fidelity is highly in demand for expanding the potential of organic light-emitting diodes (OLEDs) from mobile and TV displays into near-to-eye microdisplays. However, current patterning techniques so far suffer from low resolution, consecutive pattern for RGB pixelation, low pattern fidelity, and throughput issue. Here, we present a silicone engineered anisotropic lithography of the organic light-emitting semiconductor (OLES) that in-situ forms a non-volatile etch-blocking layer during reactive ion etching. This unique feature not only slows the etch rate but also enhances the anisotropy of etch direction, leading to gain delicate control in forming ultrahigh-density multicolor OLES patterns (up to 4500 pixels per inch) through photolithography. This patterning strategy inspired by silicon etching chemistry is expected to provide new insights into ultrahigh-density OLED microdisplays.

Date: 2022
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DOI: 10.1038/s41467-022-34531-y

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