3D printing of thermosets with diverse rheological and functional applicabilities

Yuxuan Sun, Liu Wang (), Yangyang Ni, Huajian Zhang, Xiang Cui, Jiahao Li, Yinbo Zhu, Ji Liu, Shiwu Zhang, Yong Chen () and Mujun Li ()
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Yuxuan Sun: University of Science and Technology of China
Liu Wang: University of Science and Technology of China
Yangyang Ni: University of Science and Technology of China
Huajian Zhang: University of Science and Technology of China
Xiang Cui: University of Science and Technology of China
Jiahao Li: University of Science and Technology of China
Yinbo Zhu: University of Science and Technology of China
Ji Liu: Southern University of Science and Technology of China
Shiwu Zhang: University of Science and Technology of China
Yong Chen: Viterbi School of Engineering, University of Southern California
Mujun Li: University of Science and Technology of China

Nature Communications, 2023, vol. 14, issue 1, 1-10

Abstract: Abstract Thermosets such as silicone are ubiquitous. However, existing manufacturing of thermosets involves either a prolonged manufacturing cycle (e.g., reaction injection molding), low geometric complexity (e.g., casting), or limited processable materials (e.g., frontal polymerization). Here, we report an in situ dual heating (ISDH) strategy for the rapid 3D printing of thermosets with complex structures and diverse rheological properties by incorporating direct ink writing (DIW) technique and a heating-accelerated in situ gelation mechanism. Enabled by an integrated Joule heater at the printhead, extruded thermosetting inks can quickly cure in situ, allowing for DIW of various thermosets with viscosities spanning five orders of magnitude, printed height over 100 mm, and high resolution of 50 μm. We further demonstrate DIW of a set of heterogenous thermosets using multiple functional materials and present a hybrid printing of a multilayer soft electronic circuit. Our ISDH strategy paves the way for fast manufacturing of thermosets for various emerging fields.

Date: 2023
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DOI: 10.1038/s41467-023-35929-y

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