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Half-Heusler alloys as emerging high power density thermoelectric cooling materials

Hangtian Zhu (), Wenjie Li (), Amin Nozariasbmarz, Na Liu, Yu Zhang, Shashank Priya () and Bed Poudel ()
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Hangtian Zhu: Pennsylvania State University
Wenjie Li: Pennsylvania State University
Amin Nozariasbmarz: Pennsylvania State University
Na Liu: Pennsylvania State University
Yu Zhang: Pennsylvania State University
Shashank Priya: Pennsylvania State University
Bed Poudel: Pennsylvania State University

Nature Communications, 2023, vol. 14, issue 1, 1-8

Abstract: Abstract To achieve optimal thermoelectric performance, it is crucial to manipulate the scattering processes within materials to decouple the transport of phonons and electrons. In half-Heusler (hH) compounds, selective defect reduction can significantly improve performance due to the weak electron-acoustic phonon interaction. This study utilized Sb-pressure controlled annealing process to modulate the microstructure and point defects of Nb0.55Ta0.40Ti0.05FeSb compound, resulting in a 100% increase in carrier mobility and a maximum power factor of 78 µW cm−1 K−2, approaching the theoretical prediction for NbFeSb single crystal. This approach yielded the highest average zT of ~0.86 among hH in the temperature range of 300-873 K. The use of this material led to a 210% enhancement in cooling power density compared to Bi2Te3-based devices and a conversion efficiency of 12%. These results demonstrate a promising strategy for optimizing hH materials for near-room-temperature thermoelectric applications.

Date: 2023
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DOI: 10.1038/s41467-023-38446-0

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