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Anion redox as a means to derive layered manganese oxychalcogenides with exotic intergrowth structures

Shunsuke Sasaki, Souvik Giri, Simon J. Cassidy, Sunita Dey, Maria Batuk, Daphne Vandemeulebroucke, Giannantonio Cibin, Ronald I. Smith, Philip Holdship, Clare P. Grey, Joke Hadermann and Simon J. Clarke ()
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Shunsuke Sasaki: University of Oxford, Inorganic Chemistry Laboratory
Souvik Giri: University of Oxford, Inorganic Chemistry Laboratory
Simon J. Cassidy: University of Oxford, Inorganic Chemistry Laboratory
Sunita Dey: University of Cambridge
Maria Batuk: University of Antwerp
Daphne Vandemeulebroucke: University of Antwerp
Giannantonio Cibin: Harwell Science and Innovation Campus
Ronald I. Smith: The ISIS Facility, STFC Rutherford Appleton Laboratory, Harwell Campus
Philip Holdship: University of Oxford
Clare P. Grey: University of Cambridge
Joke Hadermann: University of Antwerp
Simon J. Clarke: University of Oxford, Inorganic Chemistry Laboratory

Nature Communications, 2023, vol. 14, issue 1, 1-11

Abstract: Abstract Topochemistry enables step-by-step conversions of solid-state materials often leading to metastable structures that retain initial structural motifs. Recent advances in this field revealed many examples where relatively bulky anionic constituents were actively involved in redox reactions during (de)intercalation processes. Such reactions are often accompanied by anion-anion bond formation, which heralds possibilities to design novel structure types disparate from known precursors, in a controlled manner. Here we present the multistep conversion of layered oxychalcogenides Sr2MnO2Cu1.5Ch2 (Ch = S, Se) into Cu-deintercalated phases where antifluorite type [Cu1.5Ch2]2.5- slabs collapsed into two-dimensional arrays of chalcogen dimers. The collapse of the chalcogenide layers on deintercalation led to various stacking types of Sr2MnO2Ch2 slabs, which formed polychalcogenide structures unattainable by conventional high-temperature syntheses. Anion-redox topochemistry is demonstrated to be of interest not only for electrochemical applications but also as a means to design complex layered architectures.

Date: 2023
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DOI: 10.1038/s41467-023-38489-3

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