Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics

Gun-Hee Lee, Do Hoon Lee, Woojin Jeon, Jihwan Yoon, Kwangguk Ahn, Kum Seok Nam, Min Kim, Jun Kyu Kim, Yong Hoe Koo, Jinmyoung Joo, WooChul Jung, Jaehong Lee, Jaewook Nam, Seongjun Park (), Jae-Woong Jeong () and Steve Park ()
Additional contact information
Gun-Hee Lee: Korea Advanced Institute of Science and Technology (KAIST)
Do Hoon Lee: Korea Advanced Institute of Science and Technology (KAIST)
Woojin Jeon: Korea Advanced Institute of Science and Technology (KAIST)
Jihwan Yoon: Seoul National University
Kwangguk Ahn: Seoul National University
Kum Seok Nam: Korea Advanced Institute of Science and Technology (KAIST)
Min Kim: Korea Advanced Institute of Science and Technology (KAIST)
Jun Kyu Kim: Korea Advanced Institute of Science and Technology (KAIST)
Yong Hoe Koo: Ulsan National Institute of Science and Technology (UNIST)
Jinmyoung Joo: Ulsan National Institute of Science and Technology (UNIST)
WooChul Jung: Korea Advanced Institute of Science and Technology (KAIST)
Jaehong Lee: Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Jaewook Nam: Seoul National University
Seongjun Park: Korea Advanced Institute of Science and Technology (KAIST)
Jae-Woong Jeong: Korea Advanced Institute of Science and Technology (KAIST)
Steve Park: Korea Advanced Institute of Science and Technology (KAIST)

Nature Communications, 2023, vol. 14, issue 1, 1-10

Abstract: Abstract Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes.

Date: 2023
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DOI: 10.1038/s41467-023-39928-x

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