Enhanced copper anticorrosion from Janus-doped bilayer graphene
Mengze Zhao,
Zhibin Zhang (),
Wujun Shi,
Yiwei Li,
Chaowu Xue,
Yuxiong Hu,
Mingchao Ding,
Zhiqun Zhang,
Zhi Liu,
Ying Fu,
Can Liu,
Muhong Wu,
Zhongkai Liu,
Xin-Zheng Li,
Zhu-Jun Wang () and
Kaihui Liu ()
Additional contact information
Mengze Zhao: Peking University
Zhibin Zhang: Peking University
Wujun Shi: ShanghaiTech University
Yiwei Li: ShanghaiTech University
Chaowu Xue: ShanghaiTech University
Yuxiong Hu: ShanghaiTech University
Mingchao Ding: Chinese Academy of Sciences
Zhiqun Zhang: ShanghaiTech University
Zhi Liu: ShanghaiTech University
Ying Fu: Chinese Academy of Sciences
Can Liu: Renmin University of China
Muhong Wu: Chinese Academy of Sciences
Zhongkai Liu: ShanghaiTech University
Xin-Zheng Li: Peking University
Zhu-Jun Wang: ShanghaiTech University
Kaihui Liu: Peking University
Nature Communications, 2023, vol. 14, issue 1, 1-8
Abstract:
Abstract The atomic-thick anticorrosion coating for copper (Cu) electrodes is essential for the miniaturisation in the semiconductor industry. Graphene has long been expected to be the ultimate anticorrosion material, however, its real anticorrosion performance is still under great controversy. Specifically, strong electronic couplings can limit the interfacial diffusion of corrosive molecules, whereas they can also promote the surficial galvanic corrosion. Here, we report the enhanced anticorrosion for Cu simply via a bilayer graphene coating, which provides protection for more than 5 years at room temperature and 1000 h at 200 °C. Such excellent anticorrosion is attributed to a nontrivial Janus-doping effect in bilayer graphene, where the heavily doped bottom layer forms a strong interaction with Cu to limit the interfacial diffusion, while the nearly charge neutral top layer behaves inertly to alleviate the galvanic corrosion. Our study will likely expand the application scenarios of Cu under various extreme operating conditions.
Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:nat:natcom:v:14:y:2023:i:1:d:10.1038_s41467-023-43357-1
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DOI: 10.1038/s41467-023-43357-1
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