Performance boost for bismuth telluride thermoelectric generator via barrier layer based on low Young’s modulus and particle sliding
Yuxin Sun,
Fengkai Guo (),
Yan Feng,
Chun Li,
Yongchun Zou,
Jinxuan Cheng,
Xingyan Dong,
Hao Wu,
Qian Zhang,
Weishu Liu,
Zihang Liu,
Wei Cai,
Zhifeng Ren () and
Jiehe Sui ()
Additional contact information
Yuxin Sun: Harbin Institute of Technology
Fengkai Guo: Harbin Institute of Technology
Yan Feng: Northwestern Polytechnical University
Chun Li: Harbin Institute of Technology
Yongchun Zou: Harbin Institute of Technology
Jinxuan Cheng: Harbin Institute of Technology
Xingyan Dong: Harbin Institute of Technology
Hao Wu: Harbin Institute of Technology
Qian Zhang: Harbin Institute of Technology
Weishu Liu: Southern University of Science and Technology
Zihang Liu: Harbin Institute of Technology
Wei Cai: Harbin Institute of Technology
Zhifeng Ren: University of Houston
Jiehe Sui: Harbin Institute of Technology
Nature Communications, 2023, vol. 14, issue 1, 1-9
Abstract:
Abstract The lack of desirable diffusion barrier layers currently prohibits the long-term stable service of bismuth telluride thermoelectric devices in low-grade waste heat recovery. Here we propose a new design principle of barrier layers beyond the thermal expansion matching criterion. A titanium barrier layer with loose structure is optimized, in which the low Young’s modulus and particle sliding synergistically alleviates interfacial stress, while the TiTe2 reactant enables metallurgical bonding and ohmic contact between the barrier layer and the thermoelectric material, leading to a desirable interface characterized by high-thermostability, high-strength, and low-resistivity. Highly competitive conversion efficiency of 6.2% and power density of 0.51 W cm−2 are achieved for a module with leg length of 2 mm at the hot-side temperature of 523 K, and no degradation is observed following operation for 360 h, a record for stable service at this temperature, paving the way for its application in low-grade waste heat recovery.
Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:nat:natcom:v:14:y:2023:i:1:d:10.1038_s41467-023-43879-8
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DOI: 10.1038/s41467-023-43879-8
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