Modulation of the morphotropic phase boundary for high-performance ductile thermoelectric materials
Jiasheng Liang,
Jin Liu,
Pengfei Qiu (),
Chen Ming,
Zhengyang Zhou,
Zhiqiang Gao,
Kunpeng Zhao (),
Lidong Chen and
Xun Shi ()
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Jiasheng Liang: Chinese Academy of Sciences
Jin Liu: Chinese Academy of Sciences
Pengfei Qiu: Chinese Academy of Sciences
Chen Ming: Chinese Academy of Sciences
Zhengyang Zhou: Chinese Academy of Sciences
Zhiqiang Gao: Chinese Academy of Sciences
Kunpeng Zhao: Shanghai Jiao Tong University
Lidong Chen: Chinese Academy of Sciences
Xun Shi: Chinese Academy of Sciences
Nature Communications, 2023, vol. 14, issue 1, 1-8
Abstract:
Abstract The flexible thermoelectric technique, which can convert heat from the human body to electricity via the Seebeck effect, is expected to provide a peerless solution for the power supply of wearables. The recent discovery of ductile semiconductors has opened a new avenue for flexible thermoelectric technology, but their power factor and figure-of-merit values are still much lower than those of classic thermoelectric materials. Herein, we demonstrate the presence of morphotropic phase boundary in Ag2Se-Ag2S pseudobinary compounds. The morphotropic phase boundary can be freely tuned by adjusting the material thermal treatment processes. High-performance ductile thermoelectric materials with excellent power factor (22 μWcm−1 K−2) and figure-of-merit (0.61) values are realized near the morphotropic phase boundary at 300 K. These materials perform better than all existing ductile inorganic semiconductors and organic materials. Furthermore, the in-plane flexible thermoelectric device based on these high-performance thermoelectric materials demonstrates a normalized maximum power density reaching 0.26 Wm−1 under a temperature gradient of 20 K, which is at least two orders of magnitude higher than those of flexible organic thermoelectric devices. This work can greatly accelerate the development of flexible thermoelectric technology.
Date: 2023
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DOI: 10.1038/s41467-023-44318-4
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