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Well-defined in-textile photolithography towards permeable textile electronics

Pengwei Wang, Xiaohao Ma, Zhiqiang Lin, Fan Chen, Zijian Chen, Hong Hu, Hailong Xu, Xinyi Zhang, Yuqing Shi, Qiyao Huang (), Yuanjing Lin () and Zijian Zheng ()
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Pengwei Wang: The Hong Kong Polytechnic University
Xiaohao Ma: The Hong Kong Polytechnic University
Zhiqiang Lin: The Hong Kong Polytechnic University
Fan Chen: The Hong Kong Polytechnic University
Zijian Chen: The Hong Kong Polytechnic University
Hong Hu: The Hong Kong Polytechnic University
Hailong Xu: The Hong Kong Polytechnic University
Xinyi Zhang: Southern University of Science and Technology
Yuqing Shi: The Hong Kong Polytechnic University
Qiyao Huang: The Hong Kong Polytechnic University
Yuanjing Lin: Southern University of Science and Technology
Zijian Zheng: The Hong Kong Polytechnic University

Nature Communications, 2024, vol. 15, issue 1, 1-12

Abstract: Abstract Textile-based wearable electronics have attracted intensive research interest due to their excellent flexibility and breathability inherent in the unique three-dimensional porous structures. However, one of the challenges lies in achieving highly conductive patterns with high precision and robustness without sacrificing the wearing comfort. Herein, we developed a universal and robust in-textile photolithography strategy for precise and uniform metal patterning on porous textile architectures. The as-fabricated metal patterns realized a high precision of sub-100 µm with desirable mechanical stability, washability, and permeability. Moreover, such controllable coating permeated inside the textile scaffold contributes to the significant performance enhancement of miniaturized devices and electronics integration through both sides of the textiles. As a proof-of-concept, a fully integrated in-textiles system for multiplexed sweat sensing was demonstrated. The proposed method opens up new possibilities for constructing multifunctional textile-based flexible electronics with reliable performance and wearing comfort.

Date: 2024
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DOI: 10.1038/s41467-024-45287-y

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