Anti-friction gold-based stretchable electronics enabled by interfacial diffusion-induced cohesion

Jie Cao, Xusheng Liu, Jie Qiu, Zhifei Yue, Yang Li, Qian Xu, Yan Chen, Jiewen Chen, Hongfei Cheng, Guozhong Xing, Enming Song, Ming Wang (), Qi Liu () and Ming Liu
Additional contact information
Jie Cao: Fudan University
Xusheng Liu: Fudan University
Jie Qiu: Fudan University
Zhifei Yue: Fudan University
Yang Li: Fudan University
Qian Xu: Fudan University
Yan Chen: Fudan University
Jiewen Chen: Fudan University
Hongfei Cheng: Tongji University
Guozhong Xing: Chinese Academy of Sciences
Enming Song: Fudan University
Ming Wang: Fudan University
Qi Liu: Fudan University
Ming Liu: Fudan University

Nature Communications, 2024, vol. 15, issue 1, 1-11

Abstract: Abstract Stretchable electronics that prevalently adopt chemically inert metals as sensing layers and interconnect wires have enabled high-fidelity signal acquisition for on-skin applications. However, the weak interfacial interaction between inert metals and elastomers limit the tolerance of the device to external friction interferences. Here, we report an interfacial diffusion-induced cohesion strategy that utilizes hydrophilic polyurethane to wet gold (Au) grains and render them wrapped by strong hydrogen bonding, resulting in a high interfacial binding strength of 1017.6 N/m. By further constructing a nanoscale rough configuration of the polyurethane (RPU), the binding strength of Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane and styrene-ethylene-butylene-styrene-based devices, respectively. The stretchable Au-RPU device can remain good electrical conductivity after 1022 frictions at 130 kPa pressure, and reliably record high-fidelity electrophysiological signals. Furthermore, an anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating a superior mechanical durability for concentrated large pressure acquisition. This chemical modification-free approach of interfacial strengthening for chemically inert metal-based stretchable electronics is promising for three-dimensional integration and on-chip interconnection.

Date: 2024
References: View references in EconPapers View complete reference list from CitEc
Citations:

Downloads: (external link)
https://www.nature.com/articles/s41467-024-45393-x Abstract (text/html)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-45393-x

Ordering information: This journal article can be ordered from
https://www.nature.com/ncomms/

DOI: 10.1038/s41467-024-45393-x

Access Statistics for this article

Nature Communications is currently edited by Nathalie Le Bot, Enda Bergin and Fiona Gillespie

More articles in Nature Communications from Nature
Bibliographic data for series maintained by Sonal Shukla () and Springer Nature Abstracting and Indexing ().