Manufacturing of high strength and high conductivity copper with laser powder bed fusion

Yingang Liu, Jingqi Zhang, Ranming Niu (), Mohamad Bayat, Ying Zhou, Yu Yin, Qiyang Tan, Shiyang Liu, Jesper Henri Hattel, Miaoquan Li, Xiaoxu Huang, Julie Cairney, Yi-Sheng Chen, Mark Easton, Christopher Hutchinson () and Ming-Xing Zhang ()
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Yingang Liu: The University of Queensland
Jingqi Zhang: The University of Queensland
Ranming Niu: Australian Centre for Microscopy and Microanalysis, The University of Sydney
Mohamad Bayat: Technical University of Denmark
Ying Zhou: State IJR Center of Aerospace Design and Additive Manufacturing, Northwestern Polytechnical University
Yu Yin: The University of Queensland
Qiyang Tan: The University of Queensland
Shiyang Liu: The University of Queensland
Jesper Henri Hattel: Technical University of Denmark
Miaoquan Li: Northwestern Polytechnical University
Xiaoxu Huang: Chongqing University
Julie Cairney: Australian Centre for Microscopy and Microanalysis, The University of Sydney
Yi-Sheng Chen: Australian Centre for Microscopy and Microanalysis, The University of Sydney
Mark Easton: RMIT University
Christopher Hutchinson: Monash University
Ming-Xing Zhang: The University of Queensland

Nature Communications, 2024, vol. 15, issue 1, 1-9

Abstract: Abstract Additive manufacturing (AM), known as 3D printing, enables rapid fabrication of geometrically complex copper (Cu) components for electrical conduction and heat management applications. However, pure Cu or Cu alloys produced by 3D printing often suffer from either low strength or low conductivity at room and elevated temperatures. Here, we demonstrate a design strategy for 3D printing of high strength, high conductivity Cu by uniformly dispersing a minor portion of lanthanum hexaboride (LaB6) nanoparticles in pure Cu through laser powder bed fusion (L-PBF). We show that trace additions of LaB6 to pure Cu results in an improved L-PBF processability, an enhanced strength, an improved thermal stability, all whilst maintaining a high conductivity. The presented strategy could expand the applicability of 3D printed Cu components to more demanding conditions where high strength, high conductivity and thermal stability are required.

Date: 2024
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DOI: 10.1038/s41467-024-45732-y

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