Simultaneous enhancement of strength and conductivity via self-assembled lamellar architecture

Tielong Han (), Chao Hou, Zhi Zhao, Zengbao Jiao, Yurong Li, Shuang Jiang, Hao Lu, Haibin Wang, Xuemei Liu, Zuoren Nie and Xiaoyan Song ()
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Tielong Han: Beijing University of Technology
Chao Hou: Beijing University of Technology
Zhi Zhao: Beijing University of Technology
Zengbao Jiao: The Hong Kong Polytechnic University
Yurong Li: Beijing University of Technology
Shuang Jiang: Northeastern University
Hao Lu: Beijing University of Technology
Haibin Wang: Beijing University of Technology
Xuemei Liu: Beijing University of Technology
Zuoren Nie: Beijing University of Technology
Xiaoyan Song: Beijing University of Technology

Nature Communications, 2024, vol. 15, issue 1, 1-11

Abstract: Abstract Simultaneous improvement of strength and conductivity is urgently demanded but challenging for bimetallic materials. Here we show by creating a self-assembled lamellar (SAL) architecture in W-Cu system, enhancement in strength and electrical conductivity is able to be achieved at the same time. The SAL architecture features alternately stacked Cu layers and W lamellae containing high-density dislocations. This unique layout not only enables predominant stress partitioning in the W phase, but also promotes hetero-deformation induced strengthening. In addition, the SAL architecture possesses strong crack-buffering effect and damage tolerance. Meanwhile, it provides continuous conducting channels for electrons and reduces interface scattering. As a result, a yield strength that doubles the value of the counterpart, an increased electrical conductivity, and a large plasticity were achieved simultaneously in the SAL W-Cu composite. This study proposes a flexible strategy of architecture design and an effective method for manufacturing bimetallic composites with excellent integrated properties.

Date: 2024
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DOI: 10.1038/s41467-024-46029-w

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