High-performance flexible p-type Ce-filled Fe3CoSb12 skutterudite thin film for medium-to-high-temperature applications

Dou Li, Xiao-Lei Shi, Jiaxi Zhu, Tianyi Cao, Xiao Ma, Meng Li, Zhuokun Han, Zhenyu Feng, Yixing Chen, Jianyuan Wang, Wei-Di Liu, Hong Zhong (), Shuangming Li () and Zhi-Gang Chen ()
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Dou Li: Northwestern Polytechnical University
Xiao-Lei Shi: Queensland University of Technology
Jiaxi Zhu: Northwestern Polytechnical University
Tianyi Cao: Queensland University of Technology
Xiao Ma: Northwestern Polytechnical University
Meng Li: Queensland University of Technology
Zhuokun Han: Northwestern Polytechnical University
Zhenyu Feng: Northwestern Polytechnical University
Yixing Chen: Northwestern Polytechnical University
Jianyuan Wang: Northwestern Polytechnical University
Wei-Di Liu: Queensland University of Technology
Hong Zhong: Northwestern Polytechnical University
Shuangming Li: Northwestern Polytechnical University
Zhi-Gang Chen: Queensland University of Technology

Nature Communications, 2024, vol. 15, issue 1, 1-13

Abstract: Abstract P-type Fe3CoSb12-based skutterudite thin films are successfully fabricated, exhibiting high thermoelectric performance, stability, and flexibility at medium-to-high temperatures, based on preparing custom target materials and employing advanced pulsed laser deposition techniques to address the bonding challenge between the thin films and high-temperature flexible polyimide substrates. Through the optimization of fabrication processing and nominal doping concentration of Ce, the thin films show a power factor of >100 μW m−1 K−2 and a ZT close to 0.6 at 653 K. After >2000 bending cycle tests at a radius of 4 mm, only a 6 % change in resistivity can be observed. Additionally, the assembled p-type Fe3CoSb12-based flexible device exhibits a power density of 135.7 µW cm−2 under a temperature difference of 100 K with the hot side at 623 K. This work fills a gap in the realization of flexible thermoelectric devices in the medium-to-high-temperature range and holds significant practical application value.

Date: 2024
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DOI: 10.1038/s41467-024-48677-4

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