Low-temperature strain-free encapsulation for perovskite solar cells and modules passing multifaceted accelerated ageing tests

Paolo Mariani, Miguel Ángel Molina-García, Jessica Barichello, Marilena Isabella Zappia, Erica Magliano, Luigi Angelo Castriotta, Luca Gabatel, Sanjay Balkrishna Thorat, Antonio Esaú Rio Castillo, Filippo Drago, Enrico Leonardi, Sara Pescetelli, Luigi Vesce, Francesco Giacomo, Fabio Matteocci, Antonio Agresti, Nicole Giorgi, Sebastiano Bellani (), Aldo Carlo () and Francesco Bonaccorso ()
Additional contact information
Paolo Mariani: University of Rome Tor Vergata
Miguel Ángel Molina-García: BeDimensional S.p.A.
Jessica Barichello: University of Rome Tor Vergata
Marilena Isabella Zappia: BeDimensional S.p.A.
Erica Magliano: University of Rome Tor Vergata
Luigi Angelo Castriotta: University of Rome Tor Vergata
Luca Gabatel: BeDimensional S.p.A.
Sanjay Balkrishna Thorat: BeDimensional S.p.A.
Antonio Esaú Rio Castillo: BeDimensional S.p.A.
Filippo Drago: Istituto Italiano di Tecnologia
Enrico Leonardi: GreatCell Solar Italia SRL
Sara Pescetelli: University of Rome Tor Vergata
Luigi Vesce: University of Rome Tor Vergata
Francesco Giacomo: University of Rome Tor Vergata
Fabio Matteocci: University of Rome Tor Vergata
Antonio Agresti: University of Rome Tor Vergata
Nicole Giorgi: BeDimensional S.p.A.
Sebastiano Bellani: BeDimensional S.p.A.
Aldo Carlo: University of Rome Tor Vergata
Francesco Bonaccorso: BeDimensional S.p.A.

Nature Communications, 2024, vol. 15, issue 1, 1-15

Abstract: Abstract Perovskite solar cells promise to be part of the future portfolio of photovoltaic technologies, but their instability is slow down their commercialization. Major stability assessments have been recently achieved but reliable accelerated ageing tests on beyond small-area cells are still poor. Here, we report an industrial encapsulation process based on the lamination of highly viscoelastic semi-solid/highly viscous liquid adhesive atop the perovskite solar cells and modules. Our encapsulant reduces the thermomechanical stresses at the encapsulant/rear electrode interface. The addition of thermally conductive two-dimensional hexagonal boron nitride into the polymeric matrix improves the barrier and thermal management properties of the encapsulant. Without any edge sealant, encapsulated devices withstood multifaceted accelerated ageing tests, retaining >80% of their initial efficiency. Our encapsulation is applicable to the most established cell configurations (direct/inverted, mesoscopic/planar), even with temperature-sensitive materials, and extended to semi-transparent cells for building-integrated photovoltaics and Internet of Things systems.

Date: 2024
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DOI: 10.1038/s41467-024-48877-y

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