Reliable wafer-scale integration of two-dimensional materials and metal electrodes with van der Waals contacts

Xiaodong Zhang, Chenxi Huang, Zeyu Li, Jun Fu, Jiaran Tian, Zhuping Ouyang, Yuliang Yang, Xiang Shao, Yulei Han, Zhenhua Qiao and Hualing Zeng ()
Additional contact information
Xiaodong Zhang: University of Science and Technology of China
Chenxi Huang: University of Science and Technology of China
Zeyu Li: University of Science and Technology of China
Jun Fu: University of Science and Technology of China
Jiaran Tian: University of Science and Technology of China
Zhuping Ouyang: University of Science and Technology of China
Yuliang Yang: University of Science and Technology of China
Xiang Shao: University of Science and Technology of China
Yulei Han: Fuzhou University
Zhenhua Qiao: University of Science and Technology of China
Hualing Zeng: University of Science and Technology of China

Nature Communications, 2024, vol. 15, issue 1, 1-9

Abstract: Abstract Since the first report on single-layer MoS2 based transistor, rapid progress has been achieved in two-dimensional (2D) material-based atomically thin electronics, providing an alternative approach to solve the bottleneck in silicon device miniaturization. In this scenario, reliable contact between the metal electrodes and the subnanometer-thick 2D materials becomes crucial in determining the device performance. Here, utilizing the quasi-van der Waals (vdW) epitaxy of metals on fluorophlogopite mica, we demonstrate an all-stacking method for the fabrication of 2D devices with high-quality vdW contacts by mechanically transferring pre-deposited metal electrodes. This technique is applicable for complex device integration with sizes up to the wafer scale and is also capable of tuning the electric characteristics of the interfacial junctions by transferring selective metals. Our results provide an efficient, scalable, and low-cost technique for 2D electronics, allowing high-density device integration as well as a handy tool for fundamental research in vdW materials.

Date: 2024
References: View references in EconPapers View complete reference list from CitEc
Citations:

Downloads: (external link)
https://www.nature.com/articles/s41467-024-49058-7 Abstract (text/html)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:nat:natcom:v:15:y:2024:i:1:d:10.1038_s41467-024-49058-7

Ordering information: This journal article can be ordered from
https://www.nature.com/ncomms/

DOI: 10.1038/s41467-024-49058-7

Access Statistics for this article

Nature Communications is currently edited by Nathalie Le Bot, Enda Bergin and Fiona Gillespie

More articles in Nature Communications from Nature
Bibliographic data for series maintained by Sonal Shukla () and Springer Nature Abstracting and Indexing ().