A solvent-free processed low-temperature tolerant adhesive

Xiaoming Xie, Yulian Jiang, Xiaoman Yao, Jiaqi Zhang, Zilin Zhang, Taoping Huang, Runhan Li (), Yifa Chen (), Shun-Li Li and Ya-Qian Lan ()
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Xiaoming Xie: South China Normal University
Yulian Jiang: Xinzhou Normal University
Xiaoman Yao: South China Normal University
Jiaqi Zhang: Taiyuan University of Technology
Zilin Zhang: Xinzhou Normal University
Taoping Huang: South China Normal University
Runhan Li: South China Normal University
Yifa Chen: South China Normal University
Shun-Li Li: South China Normal University
Ya-Qian Lan: South China Normal University

Nature Communications, 2024, vol. 15, issue 1, 1-8

Abstract: Abstract Ultra-low temperature resistant adhesive is highly desired yet scarce for material adhesion for the potential usage in Arctic/Antarctic or outer space exploration. Here we develop a solvent-free processed low-temperature tolerant adhesive with excellent adhesion strength and organic solvent stability, wide tolerable temperature range (i.e. −196 to 55 °C), long-lasting adhesion effect ( > 60 days, −196 °C) that exceeds the classic commercial hot melt adhesives. Furthermore, combine experimental results with theoretical calculations, the strong interaction energy between polyoxometalate and polymer is the main factor for the low-temperature tolerant adhesive, possessing enhanced cohesion strength, suppressed polymer crystallization and volumetric contraction. Notably, manufacturing at scale can be easily achieved by the facile scale-up solvent-free processing, showing much potential towards practical application in Arctic/Antarctic or planetary exploration.

Date: 2024
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DOI: 10.1038/s41467-024-49503-7

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