High-Q cavity interface for color centers in thin film diamond

Sophie W. Ding (), Michael Haas, Xinghan Guo, Kazuhiro Kuruma, Chang Jin, Zixi Li, David D. Awschalom, Nazar Delegan, F. Joseph Heremans, Alexander A. High () and Marko Loncar ()
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Sophie W. Ding: Harvard University
Michael Haas: Harvard University
Xinghan Guo: University of Chicago
Kazuhiro Kuruma: Harvard University
Chang Jin: Harvard University
Zixi Li: University of Chicago
David D. Awschalom: University of Chicago
Nazar Delegan: University of Chicago
F. Joseph Heremans: University of Chicago
Alexander A. High: University of Chicago
Marko Loncar: Harvard University

Nature Communications, 2024, vol. 15, issue 1, 1-8

Abstract: Abstract Quantum information technology offers the potential to realize unprecedented computational resources via secure channels distributing entanglement between quantum computers. Diamond, as a host to optically-accessible spin qubits, is a leading platform to realize quantum memory nodes needed to extend such quantum links. Photonic crystal (PhC) cavities enhance light-matter interaction and are essential for an efficient interface between spins and photons that are used to store and communicate quantum information respectively. Here, we demonstrate one- and two-dimensional PhC cavities fabricated in thin-film diamonds, featuring quality factors (Q) of 1.8 × 105 and 1.6 × 105, respectively, the highest Qs for visible PhC cavities realized in any material. Importantly, our fabrication process is simple and high-yield, based on conventional planar fabrication techniques, in contrast to the previous with complex undercut processes. We also demonstrate fiber-coupled 1D PhC cavities with high photon extraction efficiency, and optical coupling between a single SiV center and such a cavity at 4 K achieving a Purcell factor of 18. The demonstrated photonic platform may fundamentally improve the performance and scalability of quantum nodes and expedite the development of related technologies.

Date: 2024
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DOI: 10.1038/s41467-024-50667-5

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