Pressure-constrained sonication activation of flexible printed metal circuit

Lingxiao Cao, Zhonghao Wang, Daiwei Hu, Haoxuan Dong, Chunchun Qu, Yi Zheng, Chao Yang, Rui Zhang, Chunxiao Xing, Zhen Li, Zhe Xin, Du Chen, Zhenghe Song and Zhizhu He ()
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Lingxiao Cao: China Agricultural University
Zhonghao Wang: China Agricultural University
Daiwei Hu: China Agricultural University
Haoxuan Dong: China Agricultural University
Chunchun Qu: China Agricultural University
Yi Zheng: China Agricultural University
Chao Yang: China Agricultural University
Rui Zhang: China Agricultural University
Chunxiao Xing: China Agricultural University
Zhen Li: China Agricultural University
Zhe Xin: China Agricultural University
Du Chen: China Agricultural University
Zhenghe Song: China Agricultural University
Zhizhu He: China Agricultural University

Nature Communications, 2024, vol. 15, issue 1, 1-12

Abstract: Abstract Metal micro/nanoparticle ink-based printed circuits have shown promise for promoting the scalable application of flexible electronics due to enabling superhigh metallic conductivity with cost-effective mass production. However, it is challenging to activate printed metal-particle patterns to approach the intrinsic conductivity without damaging the flexible substrate, especially for high melting-point metals. Here, we report a pressure-constrained sonication activation (PCSA) method of the printed flexible circuits for more than dozens of metal (covering melting points from room temperature to 3422 °C) and even nonmetallic inks, which is integrated with the large-scale roll-to-roll process. The PCSA-induced synergistic heat-softening and vibration-bonding effect of particles can enable multilayer circuit interconnection and join electronic components onto printed circuits without solder within 1 s at room temperature. We demonstrate PCSA-based applications of 3D flexible origami electronics, erasable and foldable double-sided electroluminescent displays, and custom-designed and large-area electronic textiles, thus indicating its potential for universality in flexible electronics.

Date: 2024
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DOI: 10.1038/s41467-024-52873-7

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