3D alignment of distant patterns with deep-subwavelength precision using metasurfaces

Maryam Ghahremani, Andrew McClung, Babak Mirzapourbeinekalaye and Amir Arbabi ()
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Maryam Ghahremani: University of Massachusetts Amherst
Andrew McClung: University of Massachusetts Amherst
Babak Mirzapourbeinekalaye: University of Massachusetts Amherst
Amir Arbabi: University of Massachusetts Amherst

Nature Communications, 2024, vol. 15, issue 1, 1-8

Abstract: Abstract Measurement of the relative positions of two objects in three dimensions with sub-nanometer precision is essential to fundamental physics experiments and applications such as aligning multi-layer patterns of semiconductor chips. Existing methods, which rely on microscopic imaging and registration of distant patterns, lack the required accuracy and precision for the next generation of three-dimensional (3D) chips. Here we show that 3D misalignment between two distant objects can be measured using metasurface alignment marks, a laser, and a camera with sub-nanometer precision. Through simulations, we demonstrate that the shot noise-limited precisions of the lateral and axial misalignments between the marks are λ0/50, 000 and λ0/6, 300 (λ0: laser’s wavelength), respectively. With its high precision and simplicity, the technique enables the next generation of 3D-integrated optical and electronic chips and paves the way for developing cost-effective and compact sensors relying on sub-nanometer displacement measurements.

Date: 2024
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DOI: 10.1038/s41467-024-53219-z

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