Medium-scale flexible integrated circuits based on 2D semiconductors

Yalin Peng, Chenyang Cui, Lu Li, Yuchen Wang, Qinqin Wang, Jinpeng Tian, Zhiheng Huang, Biying Huang, Yangkun Zhang, Xiuzhen Li, Jian Tang, Yanbang Chu, Wei Yang, Dongxia Shi, Luojun Du (), Na Li () and Guangyu Zhang ()
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Yalin Peng: Chinese Academy of Sciences
Chenyang Cui: Chinese Academy of Sciences
Lu Li: Chinese Academy of Sciences
Yuchen Wang: Chinese Academy of Sciences
Qinqin Wang: Chinese Academy of Sciences
Jinpeng Tian: Chinese Academy of Sciences
Zhiheng Huang: Chinese Academy of Sciences
Biying Huang: Chinese Academy of Sciences
Yangkun Zhang: Chinese Academy of Sciences
Xiuzhen Li: Chinese Academy of Sciences
Jian Tang: Chinese Academy of Sciences
Yanbang Chu: Chinese Academy of Sciences
Wei Yang: Chinese Academy of Sciences
Dongxia Shi: Chinese Academy of Sciences
Luojun Du: Chinese Academy of Sciences
Na Li: Chinese Academy of Sciences
Guangyu Zhang: Chinese Academy of Sciences

Nature Communications, 2024, vol. 15, issue 1, 1-8

Abstract: Abstract Two-dimensional (2D) semiconductors, combining remarkable electrical properties and mechanical flexibility, offer fascinating opportunities for flexible integrated circuits (ICs). Despite notable progress, so far the showcased 2D flexible ICs have been constrained to basic logic gates and ring oscillators with a maximum integration scale of a few thin film transistors (TFTs), creating a significant disparity in terms of circuit scale and functionality. Here, we demonstrate medium-scale flexible ICs integrating both combinational and sequential elements based on 2D molybdenum disulfide (MoS2). By co-optimization of the fabrication processes, flexible MoS2 TFTs with high device yield and homogeneity are implemented, as well as flexible NMOS inverters with robust rail-to-rail operation. Further, typical IC modules, such as NAND, XOR, half-adder and latch, are created on flexible substrates. Finally, a medium-scale flexible clock division module consisting of 112 MoS2 TFTs is demonstrated based on an edge-triggered Flip-Flop circuit. Our work scales up 2D flexible ICs to medium-scale, showing promising developments for various applications, including internet of everything, health monitoring and implantable electronics.

Date: 2024
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DOI: 10.1038/s41467-024-55142-9

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