Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling

Rui Cheng, Qixian Wang, Zexiao Wang, Lin Jing, Ana V. Garcia-Caraveo, Zhuo Li, Yibai Zhong, Xiu Liu, Xiao Luo, Tianyi Huang, Hyeong Seok Yun, Hakan Salihoglu, Loren Russell, Navid Kazem, Tianyi Chen and Sheng Shen ()
Additional contact information
Rui Cheng: 5000 Forbes Ave
Qixian Wang: 5000 Forbes Ave
Zexiao Wang: 5000 Forbes Ave
Lin Jing: 5000 Forbes Ave
Ana V. Garcia-Caraveo: 1791 SW Campus Way
Zhuo Li: 5000 Forbes Ave
Yibai Zhong: 5000 Forbes Ave
Xiu Liu: 5000 Forbes Ave
Xiao Luo: 5000 Forbes Ave
Tianyi Huang: 5000 Forbes Ave
Hyeong Seok Yun: 5000 Forbes Ave
Hakan Salihoglu: 5000 Forbes Ave
Loren Russell: 201 N Braddock Ave STE 334
Navid Kazem: 201 N Braddock Ave STE 334
Tianyi Chen: 1791 SW Campus Way
Sheng Shen: 5000 Forbes Ave

Nature Communications, 2025, vol. 16, issue 1, 1-8

Abstract: Abstract Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance

Date: 2025
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DOI: 10.1038/s41467-025-56163-8

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