An impermeable copper surface monolayer with high-temperature oxidation resistance

Su Jae Kim, Young-Hoon Kim, Bipin Lamichhane, Binod Regmi, Yousil Lee, Sang-Hyeok Yang, Seon Je Kim, Min-Hyoung Jung, Jae Hyuck Jang, Hu Young Jeong, Miaofang Chi, Maeng-Je Seong, Hak Soo Choi, Seong-Gon Kim (), Young-Min Kim () and Se-Young Jeong ()
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Su Jae Kim: Pusan National University
Young-Hoon Kim: Sungkyunkwan University
Bipin Lamichhane: Mississippi State University
Binod Regmi: Mississippi State University
Yousil Lee: Copper Innovative Technology (CIT) Co.
Sang-Hyeok Yang: Sungkyunkwan University
Seon Je Kim: Sungkyunkwan University
Min-Hyoung Jung: Sungkyunkwan University
Jae Hyuck Jang: Korea Basic Science Institute (KBSI)
Hu Young Jeong: Ulsan National Institute of Science and Technology
Miaofang Chi: Oak Ridge National Laboratory
Maeng-Je Seong: Chung-Ang University
Hak Soo Choi: Massachusetts General Hospital and Harvard Medical School
Seong-Gon Kim: Mississippi State University
Young-Min Kim: Sungkyunkwan University
Se-Young Jeong: Massachusetts General Hospital and Harvard Medical School

Nature Communications, 2025, vol. 16, issue 1, 1-11

Abstract: Abstract Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and Fe at temperatures exceeding 200 °C. Inspired by the concept that oxygen (O) itself can effectively obstruct the pathway of O infiltration, this study proposes the immobilization of O on the metal surface. Through extensive calculations considering various elements (C, Al, Si, Ge, Ga, In, and Sn) to anchor O on Cu surfaces, Si emerges as the optimal element. The theoretical findings are validated through systematic sputtering deposition experiments. The introduction of anchoring elements to reinforce Cu–O bonds enables the formation of an atomically thin barrier on the Cu surface, rendering it impermeable to O even at high temperatures (400 °C) while preserving its intrinsic conductivity. This oxidation resistance, facilitated by the impermeable atomic monolayer, opens promising opportunities for researchers and industries to overcome limitations associated with the use of oxidizable metal films.

Date: 2025
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DOI: 10.1038/s41467-025-56709-w

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