An ultrastretchable seamlessly integrated contactless charging microsystem towards skin-attachable wireless microelectronics

Zhihao Ren, Xiaoyu Shi (), Qing Yang, Chunsheng Li, Hanqing Liu, Tiesheng Bai, Yuan Ma, Pratteek Das, Haofeng Liu, Endian Yang, Shengye Jin, Liang Feng, Quan Shi, Xinhe Bao, Hui-Ming Cheng () and Zhong-Shuai Wu ()
Additional contact information
Zhihao Ren: 457 Zhongshan Road
Xiaoyu Shi: 457 Zhongshan Road
Qing Yang: 457 Zhongshan Road
Chunsheng Li: 457 Zhongshan Road
Hanqing Liu: 457 Zhongshan Road
Tiesheng Bai: 457 Zhongshan Road
Yuan Ma: 457 Zhongshan Road
Pratteek Das: 457 Zhongshan Road
Haofeng Liu: 457 Zhongshan Road
Endian Yang: 457 Zhongshan Road
Shengye Jin: 457 Zhongshan Road
Liang Feng: 457 Zhongshan Road
Quan Shi: 457 Zhongshan Road
Xinhe Bao: 457 Zhongshan Road
Hui-Ming Cheng: Chinese Academy of Sciences
Zhong-Shuai Wu: 457 Zhongshan Road

Nature Communications, 2025, vol. 16, issue 1, 1-10

Abstract: Abstract For electronics to be wearable, contactless charging and overall deformability are necessary pre-conditions. However, the current heterogeneous integration based on different active materials and separate manufacturing often leads to mechanical mismatch. Here, we report an ultrastretchable all-in-one integrated MXene-based microsystem comprising wireless coils, micro-supercapacitors (MSCs) and strain sensors. The seamless configuration without any connecting interface dramatically improves the structural integrity of the microsystem, and a pre-crumpled structure endows it with superior stretchability. Attributed to these, our MSCs can be wirelessly charged in ~20 s under various types of deformation and are capable of powering strain sensors, responding rapidly to body motion signals. Moreover, the MSCs display a high specific capacitance of 76.82 F cm–3, and superb mechanical stability with 98.5% capacitance retention after biaxial stretching 1000 cycles from 0% to 500% areal strain. Therefore, this work sheds new insights into design and implementation of skin-attachable wireless microelectronics.

Date: 2025
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DOI: 10.1038/s41467-025-56881-z

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