Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling

Wenjun Xu, Jiarong Cui, Yao Ma, Zhanpeng Hu, Yuyang Qi, Xinying Li, Yuchen Zhong, Tao Luo, Xuyang Chu, Linjing Wu, Weisong Ling () and Wei Zhou ()
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Wenjun Xu: Xiamen University
Jiarong Cui: Xiamen University
Yao Ma: Xiamen University
Zhanpeng Hu: Xiamen University
Yuyang Qi: Xiamen University
Xinying Li: The Hong Kong Polytechnic University
Yuchen Zhong: Xiamen University
Tao Luo: Xiamen University
Xuyang Chu: Xiamen University
Linjing Wu: Xiamen University
Weisong Ling: Xiamen University
Wei Zhou: Xiamen University

Nature Communications, 2025, vol. 16, issue 1, 1-15

Abstract: Abstract Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/m·K. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.

Date: 2025
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DOI: 10.1038/s41467-025-56960-1

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