Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors
Hao-Yu Lan,
Chih-Pin Lin,
Lina Liu,
Jun Cai,
Zheng Sun,
Peng Wu,
Yuanqiu Tan,
Shao-Heng Yang,
Tuo-Hung Hou,
Joerg Appenzeller and
Zhihong Chen ()
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Hao-Yu Lan: Purdue University
Chih-Pin Lin: Purdue University
Lina Liu: Purdue University
Jun Cai: Purdue University
Zheng Sun: Purdue University
Peng Wu: Massachusetts Institute of Technology
Yuanqiu Tan: Purdue University
Shao-Heng Yang: Purdue University
Tuo-Hung Hou: National Yang Ming Chiao Tung University
Joerg Appenzeller: Purdue University
Zhihong Chen: Purdue University
Nature Communications, 2025, vol. 16, issue 1, 1-14
Abstract:
Abstract Atomically thin two-dimensional (2D) semiconductors are promising candidates for beyond-silicon electronic devices. However, an excessive contact resistance due to ineffective or non-existent doping techniques hinders their technological readiness. Here, we unveil the doping mechanism of pure nitric oxide and demonstrate its effectiveness on wafer-scale grown monolayer and bilayer tungsten diselenide (1L- and 2L-WSe2) transistors, where doping bands induced by nitric oxide can realign the Schottky barrier and approach p-type unipolar transport. This doping approach, combined with a scaled high-κ dielectric, yields WSe2 transistors with high performance metrics. For monolayer WSe2, we achieved an on-state current of 300 μA/μm (at a drain-to-source voltage of –1 V and overdrive voltage of –0.8 V), contact resistance of 875 Ω·μm, peak transconductance of 400 μS/μm, and a subthreshold swing of 70 mV/dec, while preserving on/off ratios >109, minimal variability, and good stability over 24 days under moderate thermal conditions. For bilayer WSe2, the devices exhibit an on-state current of 448 μA/μm and contact resistance of 390 Ω·μm, further showcasing the scalability and effectiveness of the NO doping method. Our findings establish NO doping as a promising technique for realizing high-performance p-type 2D transistors and advancing next-generation ultra-scaled electronic devices.
Date: 2025
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DOI: 10.1038/s41467-025-59423-9
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