Frontal polymerization of thermosets to enable vacuum-formed structural electronics

Hayden E. Fowler, Mychal S. Taylor, Chi Phuong H. Nguyen, David A. Boese, Esteban Baca, Andrew J. Greenlee, Georgia E. Kaufman, Michael A. Gallegos, Emily F. Huntley, Leah N. Appelhans, Bryan Kaehr () and Samuel C. Leguizamon ()
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Hayden E. Fowler: Sandia National Laboratories
Mychal S. Taylor: Sandia National Laboratories
Chi Phuong H. Nguyen: Sandia National Laboratories
David A. Boese: Sandia National Laboratories
Esteban Baca: Sandia National Laboratories
Andrew J. Greenlee: Sandia National Laboratories
Georgia E. Kaufman: Sandia National Laboratories
Michael A. Gallegos: Sandia National Laboratories
Emily F. Huntley: Sandia National Laboratories
Leah N. Appelhans: Sandia National Laboratories
Bryan Kaehr: Sandia National Laboratories
Samuel C. Leguizamon: Sandia National Laboratories

Nature Communications, 2025, vol. 16, issue 1, 1-11

Abstract: Abstract Material design and accessible manufacturing are often at odds with each other, calling for creative solutions to adapt high-performance materials to available processes. This challenge is represented well by in-mold electronics, an innovative approach to the manufacture of 3D circuitry and electronic components that offers game-changing advantages. In-mold electronics relies on vacuum forming processes, which are historically limited to thermoplastics. Extending these methods to include thermosets would enable manufacturing of robust components with desirable properties. Here, we provide a solution to make thermoset materials amenable to vacuum forming. Specifically, an ambient polymerization is used to transition a liquid monomeric solution to an elastomeric gel. These free-standing gels can then be vacuum formed, and the reaction can be completed via frontal polymerization. Thermoset materials produced with this method have properties that provide benefits over traditionally employed thermoplastic substrates and enable 3D device integration into environmentally demanding architectural, automotive, and extraterrestrial structures.

Date: 2025
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DOI: 10.1038/s41467-025-59455-1

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