An in-situ assembled cobweb-like adhesive with high processability

Xiaoming Xie, Runhan Li, Yongsheng Qiao, Jiaqi Zhang, Zilin Zhang, Xingyu Xu, Jie Yang, Yan-Yu Peng, Yifa Chen (), Shun-Li Li and Ya-Qian Lan ()
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Xiaoming Xie: Xinzhou Normal University
Runhan Li: South China Normal University
Yongsheng Qiao: Xinzhou Normal University
Jiaqi Zhang: University of Missouri
Zilin Zhang: Xinzhou Normal University
Xingyu Xu: Xinzhou Normal University
Jie Yang: Xinzhou Normal University
Yan-Yu Peng: South China Normal University
Yifa Chen: South China Normal University
Shun-Li Li: South China Normal University
Ya-Qian Lan: South China Normal University

Nature Communications, 2025, vol. 16, issue 1, 1-9

Abstract: Abstract Low temperature tolerant adhesive with high flexibility and adhesion strength is highly desired yet challenging owing to the presence of obvious volume shrinkage, increased brittleness, and reduced transmission of mechanical stress at low temperature. Inspired by the cobweb, we hereby develop a kind of flexible adhesive that can be used at low temperature by in-situ polymerization of disulfide bond-based polymer with polyoxometalate. This low-temperature tolerant adhesive presents high flexibility and adhesion strength, good processability and reversible adhesion ability, a wide tolerable temperature range (i.e., −196 to 50 °C), and a long-lasting adhesion effect (>80 days, −196 °C) that is significantly better than commercial solvent-free adhesives. The adhesive can be processed into high-strength cobwebs, injected into tiny tube models, and adhered onto complicated interfaces. Notably, it enables to be kilogram-scale produced through a solvent-free method, holding promise for potential utilization in fields like repairing artifacts or precision instruments with micro-fractures at low temperature.

Date: 2025
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DOI: 10.1038/s41467-025-60076-x

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