Directly printed standing ceramic circuit boards for rapid prototyping of miniaturization and high-power of electronics

Guangming Zhang (), Zhihao Yu, Daosen Song, Zhiguo Fu, Xiaoyang Zhu (), Hongke Li, Peikai Duan, Lei Qian, Jiawei Zhao, Quan Xu, Jiankang He, Dichen Li and Hongbo Lan ()
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Guangming Zhang: Qingdao University of Technology
Zhihao Yu: Qingdao University of Technology
Daosen Song: Qingdao University of Technology
Zhiguo Fu: Qingdao University of Technology
Xiaoyang Zhu: Qingdao University of Technology
Hongke Li: Qingdao University of Technology
Peikai Duan: Qingdao University of Technology
Lei Qian: The Hong Kong Polytechnic University
Jiawei Zhao: Qingdao University of Technology
Quan Xu: Qingdao University of Technology
Jiankang He: Xi’an Jiaotong University
Dichen Li: Xi’an Jiaotong University
Hongbo Lan: Qingdao University of Technology

Nature Communications, 2025, vol. 16, issue 1, 1-11

Abstract: Abstract Ceramic circuit boards (CCBs) have been extensively utilized in 5G communications, aerospace, and artificial intelligence due to their excellent thermal conductivity and electrical performance. However, due to the limitation of manufacturing technologies, the existing CCBs can not take into account both the resolution and thickness, which restricts the miniaturization and high power of the resulting electronics. Herein, we report a standing-CCBs (S-CCBs) with both high-resolution and high aspect-ratio fabricated via sacrificial coating-assisted micro-3D printing. Benefiting from this technique, S-CCBs can be easily printed as a tall and thin-walled structure without landslides and sintered to be highly conductive wire with an overall shrinkage on the rough ceramic substrates, achieving a line width of 7 µm and aspect-ratio of 2.3 on various ceramic substrates (Al2O3, AlN, and ZrO2) with conductivity of 5.1 × 107 S m-1. Such circuits also possess environmental compatibility under mechanical tests (1000 adhesion test and scratch test) and harsh environments (500 °C aging for 500 h and chemical attack for 500 h). The proposed technique free from traditional lithography, etching, and plating processes opens up a promising strategy of implementing both high-density integration and large current-carrying capacity.

Date: 2025
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DOI: 10.1038/s41467-025-60408-x

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