A non-pyrophoric precursor for the low temperature deposition of metallic aluminium

Erica N. Faria, Samuel P. Douglas, Shreya Mrig, Leonardo Santoni, Adam J. Clancy, Daniel W. N. Wilson and Caroline E. Knapp ()
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Erica N. Faria: University College London
Samuel P. Douglas: University College London
Shreya Mrig: University College London
Leonardo Santoni: University College London
Adam J. Clancy: University College London
Daniel W. N. Wilson: University College London
Caroline E. Knapp: University College London

Nature Communications, 2025, vol. 16, issue 1, 1-7

Abstract: Abstract The development of microelectronics prompts a search for precursors that can deposit conductive features. There is scarce research on Al as it is normally deposited using pyrophoric AlH3 etherates/aminates. Ligands can impart increased stability while maintaining the ability to deposit target materials. Accordingly, we have engineered an aluminium complex that can undergo conversion to Al(0) at 100 °C. Our multi-step synthetic design features β-ketoiminate compounds, [Al(R-ketoiminate)2Cl] (R = Me, Et, iPr, Ph and Mes, 1-5) as starting materials to obtain aluminium hydride complexes: the polymeric amidoalane Li[AlH2(iPr-Hacnac)AlH3]n (6) and the imidoalane cluster [AlH2AlH2(N-Mes)3(AlH2 ּ Li(Et2O)2)2] (8). Decomposition of 8 into aluminium metal is observed when heated under vacuum at 100 °C and is confirmed by XRD, TEM, XPS. Deposition of a highly conductive film of Al is achieved from 8 after three weeks under nitrogen at room temperature. This represents a route to metallic aluminium involving non-pyrophoric precursors at low temperatures.

Date: 2025
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DOI: 10.1038/s41467-025-60786-2

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