Self-reinforced piezoelectric chip for scaffold-free repair of critical-sized bone defects

Wei Li, Youtian Mo, Shaohua Xie, Lei Fu, Yan Ye, Yilin Zhou, Jianming Lai, Wenliang Wang (), Yao Lu (), Guoqiang Li () and Jing Tian ()
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Wei Li: Southern Medical University
Youtian Mo: Guangdong University of Education
Shaohua Xie: South China University of Technology
Lei Fu: Southern Medical University
Yan Ye: Southern Medical University
Yilin Zhou: Southern Medical University
Jianming Lai: Southern Medical University
Wenliang Wang: South China University of Technology
Yao Lu: Southern Medical University
Guoqiang Li: South China University of Technology
Jing Tian: Southern Medical University

Nature Communications, 2025, vol. 16, issue 1, 1-15

Abstract: Abstract The use of piezoelectric materials to treat critical-sized bone defects typically requires additional stimulation to generate their piezoelectric properties and the implantation of scaffolds to promote bone repair. Here we present a self-reinforced piezoelectric chip and demonstrate its efficacy in the treatment of critical-sized bone defects. Specifically, the chip is comprised of the third-generation semiconductor aluminum nitride (AlN) as a piezoelectric layer, molybdenum (Mo) electrodes, and a silicon substrate with an optimized internal cavity structure. All these components are confirmed to be non-cytotoxic. This design enables the chip to provide self-sustained and long-term electrical signals in response to physiological vibrations. After being implanted into a rabbit critical-sized femoral defect model, the chip creates a localized bioelectric microenvironment, thereby promoting vascularized bone repair within 4 weeks without using any scaffolds and additional tools. Moreover, the chip can be fixed onto the clinically used orthopedic plate system, representing a universal plug-and-play strategy.

Date: 2025
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DOI: 10.1038/s41467-025-61243-w

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