Decoupling thermal stability and insulation in dielectric polymers via donor-acceptor rearrangement

Yuting Wan, Hang Luo (), Zhongna Yan, Shuyi Shen, Jiajun Peng, Xiaona Li, Guanghu He, Dou Zhang () and Jun-Wei Zha ()
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Yuting Wan: Central South University
Hang Luo: Central South University
Zhongna Yan: Changsha University of Science and Technology
Shuyi Shen: Central South University
Jiajun Peng: Central South University
Xiaona Li: Central South University
Guanghu He: Central South University
Dou Zhang: Central South University
Jun-Wei Zha: North China Electric Power University

Nature Communications, 2025, vol. 16, issue 1, 1-11

Abstract: Abstract Polymer dielectrics with enhanced thermal stability and electrical insulation are urgently needed for capacitive energy storage applications in electric power systems. There is a persistent challenge to break the contradictory correlation between high heat resistance and low electrical conduction in polymers. Here, we employ benzyl-induced crosslinking to rearrange short-range structural units in polyimide chains, reducing electrical conduction loss. The designed polymer exhibits an electrical conductivity more than 3 orders of magnitude lower than that of commercial heat-resistant polymers, while its glass transition temperature (Tg) increases from 236.31 °C (for polyetherimide) to 289.72 °C. Consequently, a discharged energy densities of 6.38 J cm−3 and 3.04 J cm−3, with charge-discharge efficiencies above 90%, are achieved at 200 °C and 250 °C, respectively, demonstrating among the best in all-organic dielectric polymers. This work presents a feasible approach to break the adverse correlation between thermal stability and electrical insulation in polyimide materials.

Date: 2025
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DOI: 10.1038/s41467-025-61539-x

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