Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management

Chenhao Lin, Xiaojing Ma, Kun Liang, Yao Xu, Hengyu Yang, Jian Wang, Sheng Ye, Jiamin Qiu, Linlin Song, Shizhen Zhi, Jiang Chen, Peng Zhao, Sichen Duan, Zuoxu Wu, Li Yin, Longzhi Wu, Feng Jiang, Zunqian Tang, Feng Cao, Qian Zhang () and Jun Mao ()
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Chenhao Lin: Harbin Institute of Technology (Shenzhen)
Xiaojing Ma: Harbin Institute of Technology (Shenzhen)
Kun Liang: Harbin Institute of Technology (Shenzhen)
Yao Xu: Harbin Institute of Technology (Shenzhen)
Hengyu Yang: Harbin Institute of Technology (Shenzhen)
Jian Wang: Harbin Institute of Technology (Shenzhen)
Sheng Ye: Harbin Institute of Technology (Shenzhen)
Jiamin Qiu: Harbin Institute of Technology (Shenzhen)
Linlin Song: Harbin Institute of Technology (Shenzhen)
Shizhen Zhi: Harbin Institute of Technology (Shenzhen)
Jiang Chen: Harbin Institute of Technology (Shenzhen)
Peng Zhao: Harbin Institute of Technology (Shenzhen)
Sichen Duan: Harbin Institute of Technology (Shenzhen)
Zuoxu Wu: Harbin Institute of Technology (Shenzhen)
Li Yin: Harbin Institute of Technology (Shenzhen)
Longzhi Wu: Harbin Institute of Technology (Shenzhen)
Feng Jiang: Harbin Institute of Technology (Shenzhen)
Zunqian Tang: Harbin Institute of Technology (Shenzhen)
Feng Cao: Harbin Institute of Technology (Shenzhen)
Qian Zhang: Harbin Institute of Technology (Shenzhen)
Jun Mao: Harbin Institute of Technology (Shenzhen)

Nature Communications, 2025, vol. 16, issue 1, 1-9

Abstract: Abstract Miniaturized thermoelectric coolers, known for their high cooling power density and rapid thermal response, hold promise for localized thermal management. While traditional thermoelectric coolers have primarily relied on Bi2Te3 alloys, the recent development of n-type Mg3Bi2-based materials presents a compelling alternative, offering enhanced cost-effectiveness and environmental sustainability. In this study, we have designed and fabricated a Mg3Bi2-based miniscale thermoelectric cooler. At the hot-side temperature of 300 K, the cooler achieves a maximum cooling temperature difference of ~59.0 K, a cooling power density of ~5.7 W cm-2, and a cooling speed of 65 K s-1, which surpasses the state-of-the-art Mg3Bi2-based devices. In addition, the miniaturized Mg3Bi2-based cooler maintains its cooling performance after cyclic electrical current density between 1 A mm-2 and 3 A mm-2 for approximately 3,000 cycles. Notably, this miniscale cooler has been applied to provide localized cooling for the central processing unit in a microcontroller. Our findings highlight the potential of Mg3Bi2-based miniscale coolers, offering new possibilities for localized thermal management in electronic devices.

Date: 2025
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DOI: 10.1038/s41467-025-63174-y

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