Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia

Zeyu Li, Ming Zheng, Chunshuang Yan (), Dongqi Yang, Ruyu Yang, Chu Zhang, Hengjie Liu, Pin Song, Chenhui Yin, Zeming Qi, Daobin Liu, Xin Zhou (), Li Song, Chade Lv () and Guihua Yu ()
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Zeyu Li: Harbin Institute of Technology
Ming Zheng: Harbin Institute of Technology
Chunshuang Yan: Harbin Institute of Technology
Dongqi Yang: The University of Texas at Austin
Ruyu Yang: University of Science and Technology of China
Chu Zhang: Harbin Institute of Technology
Hengjie Liu: University of Science and Technology of China
Pin Song: Anhui Normal University
Chenhui Yin: School of Chemistry and Chemical Engineering
Zeming Qi: University of Science and Technology of China
Daobin Liu: University of Science and Technology of China
Xin Zhou: Harbin Institute of Technology
Li Song: University of Science and Technology of China
Chade Lv: Harbin Institute of Technology
Guihua Yu: The University of Texas at Austin

Nature Communications, 2025, vol. 16, issue 1, 1-13

Abstract: Abstract The synergistic Cu0-Cuδ+ sites are found as the active sites for NH3 synthesis through nitrate electroreduction reaction, but still face significant challenges in stabilizing the Cuδ+ due to its self-reduction. Here we propose an Ohmic contact interface engineering strategy by loading copper nano-islands on indium hydroxide nanocubes. Attributed to the lower work function of Cu than that of In(OH)3 with n-type semiconductor nature, the electrons in Cu can transfer unimpededly to In(OH)3 at the interface of Ohmic junction, triggering and stabilizing polarized Cu0-Cuδ+ active sites. Cu@In(OH)3 sustains both high NH3 yield rate (4.28 mmol h−1 mgcat.−1) and Faradaic efficiency (97.35%) at −0.6 V vs. RHE, while maintaining stability for at least 120 h under an Ampere-level of 800 mA cm−2. Such Ohmic contact interface engineering approach allows for simultaneously constructing and stabilizing the Cu0-Cuδ+ for the electrosynthesis of ammonia, as well as other value-added chemicals relying on above active sites.

Date: 2025
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DOI: 10.1038/s41467-025-63996-w

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