Efficient thermal management of electronic devices by constructing interlayer phonon bridges

Gaojie Han, Hongli Cheng, Yuezhan Feng (), Shiliang Zhang, Jingwen Dong, Bing Zhou, Xianhu Liu (), Chuntai Liu (), Guangming Tao () and Changyu Shen
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Gaojie Han: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Hongli Cheng: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Yuezhan Feng: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Shiliang Zhang: Huazhong University of Science and Technology, State Key Laboratory of New Textile Materials and Advanced Processing, Research Center for Intelligent Fiber Devices and Equipment, School of Materials Science and Engineering and School of Physical Education
Jingwen Dong: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Bing Zhou: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Xianhu Liu: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Chuntai Liu: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology
Guangming Tao: Huazhong University of Science and Technology, State Key Laboratory of New Textile Materials and Advanced Processing, Research Center for Intelligent Fiber Devices and Equipment, School of Materials Science and Engineering and School of Physical Education
Changyu Shen: Zhengzhou University, State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology

Nature Communications, 2025, vol. 16, issue 1, 1-12

Abstract: Abstract Layered film-based thermal management materials with high in-plane thermal conductivity can effectively diffuse point heat sources and prevent local overheating. However, their low through-plane thermal conductivity limits its overall heat dissipation. Here, we introduce a honeycomb-gel densification strategy that forms zigzag yet continuous interlayer phonon bridges within the layered structure. This design establishes bi-directional thermal pathways, boosting both in-plane and through-plane thermal conductivity by 488.9% and 503.3% of the aramid nanofiber/boron nitride nanosheet, respectively, compared to random-gel densified films. Also, the aramid nanofiber/boron nitride nanosheet film exhibits high solar reflectivity, infrared emissivity, and thermal radiation, enabling efficient subambient cooling (17.2 °C at 100 mW/cm²) for heat-generating devices.

Date: 2025
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DOI: 10.1038/s41467-025-65554-w

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