Advantageous grain boundaries in iron pnictide superconductors

Takayoshi Katase, Yoshihiro Ishimaru, Akira Tsukamoto, Hidenori Hiramatsu, Toshio Kamiya, Keiichi Tanabe and Hideo Hosono ()
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Takayoshi Katase: Materials and Structures Laboratory, Mailbox R3-1, Tokyo Institute of Technology
Yoshihiro Ishimaru: Superconductivity Research Laboratory, International Superconductivity Technology Center
Akira Tsukamoto: Superconductivity Research Laboratory, International Superconductivity Technology Center
Hidenori Hiramatsu: Materials and Structures Laboratory, Mailbox R3-1, Tokyo Institute of Technology
Toshio Kamiya: Materials and Structures Laboratory, Mailbox R3-1, Tokyo Institute of Technology
Keiichi Tanabe: Superconductivity Research Laboratory, International Superconductivity Technology Center
Hideo Hosono: Materials and Structures Laboratory, Mailbox R3-1, Tokyo Institute of Technology

Nature Communications, 2011, vol. 2, issue 1, 1-6

Abstract: Abstract High critical temperature superconductors have zero power consumption and could be used to produce ideal electric power lines. The principal obstacle in fabricating superconducting wires and tapes is grain boundaries—the misalignment of crystalline orientations at grain boundaries, which is unavoidable for polycrystals, largely deteriorates critical current density. Here we report that high critical temperature iron pnictide superconductors have advantages over cuprates with respect to these grain boundary issues. The transport properties through well-defined bicrystal grain boundary junctions with various misorientation angles (θGB) were systematically investigated for cobalt-doped BaFe2As2 (BaFe2As2:Co) epitaxial films fabricated on bicrystal substrates. The critical current density through bicrystal grain boundary (JcBGB) remained high (>1 MA cm−2) and nearly constant up to a critical angle θc of ∼9°, which is substantially larger than the θc of ∼5° for YBa2Cu3O7–δ. Even at θGB>θc, the decay of JcBGB was much slower than that of YBa2Cu3O7–δ.

Date: 2011
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DOI: 10.1038/ncomms1419

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